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HONGJIN
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The steam aging test chamber is suitable for the aging acceleration life time testing of electronic connectors, semiconductor ICs, transistors, diodes, LCDs, chip resistors, capacitors, and other electronic components. It is used for testing the solderability of metal leads of electronic components before soldering, as well as for the oxidation testing of semiconductor passive components and component leads. The device features a microcomputer temperature controller with LED digital display, PID+SSR control, and a platinum resistance temperature sensor (PT100), with a resolution of 0.1°C.
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