 |
| Quantity: | |
|---|---|
HONGJIN
Application Scope：
The high-speed high/low temperature shock thermal flux tester is suitable for reliability testing of various semiconductor chips, Flash memory (eMMC/Flash), PCB circuit board ICs, optical communications (such as transceivers, SFP modules under high/low temperatures), and other electronic industry components. It is used for IC characteristic analysis, high/low temperature cycling, thermal shock, failure analysis, and other reliability tests.
Product Features：
1. Fast Temperature Change Rate: The temperature can switch from -55℃ to +125℃ in as little as 13 seconds, with a wide temperature range from -65℃ to +225℃.
2. Compact Design: Mobile design with a touchscreen interface, providing quick interaction and fast DUT (Device Under Test) temperature stabilization.
3. Temperature Control Accuracy: ±1°C, with a display accuracy of ±0.1°C.
4. High Airflow Capacity: Airflow rate can reach up to 18 SCFM.
5. Defrosting Design: Quickly removes accumulated moisture inside the chamber.
6. Mechanical Refrigeration: Uses purely mechanical refrigeration, eliminating the need for liquid nitrogen or other consumable refrigerants.
Product Parameters:
Actual Product Photos:
Company Profile:
